White Papers & Technical Publications

Rochester Electronics Semiconductor Lifecycle Solutions™

Only the Rochester Electronics Semiconductor Lifecycle Solution can provide an absolute guarantee that a replacement semiconductor device will function exactly as the original.

Avoiding DO-254 Events: Major/Minor Change Classification

Examines how semiconductor ASICs and standard products are affected by manufacturing obsolescence and the need to create form, fit, and functionally equivalent devices.

The Effects of Long-Term Storage on Solderability of Semiconductor Components

Analyzes the solderability of aged semiconductor components and their performance in real-world applications after long-term storage.

Compatibility of Traditional Solderability Testing for Aged Semiconductor Components

Evaluates SMT components' solderability and board assembly performance after extended storage periods.

The Myth Behind Commercial Off-the-Shelf Up-Screening

Discusses alternatives to traditional commercial off-the-shelf (COTS) device enhancement and manufacturing approaches.

The Quality of Test

Explains Rochester Electronics' engineering-driven testing approach and the importance of proper test coverage across integrated circuit components.

The Effects of Long-Term Storage on Mechanical Integrity and Electrical Performance of Semiconductor Components

Reviews Rochester Electronics testing of components stored for extended periods and the impact of long-term storage on performance and reliability.

Combating the Risk of Semiconductor Counterfeits

Discusses counterfeit semiconductor risks and the benefits of sourcing components from authorized suppliers.

Additional certifications, industry standards, quality resources, and workflow documentation can be found throughout the Quality & White Papers section.